Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

Quick Read Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on ...

Sarcina Technology, a specialist in semiconductor and photonic packaging, has won the “Packaging: Hardware” category at the 2026 Chiplet Summit Best of Show Awards for its advanced AI package design ...

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...

Artificial intelligence is attracting significant attention, but AI and high-performance computing applications represent only about 40% of the company’s current demand. Silicon Box’s customer markets ...

ASE Technology is well-positioned to capitalize on surging AI-driven demand for advanced semiconductor packaging, particularly from 2026 onward. ASX benefits from TSMC outsourcing high-end CoWoS ...

TAIPEI, Nov. 27, 2025 /PRNewswire/ -- As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical ...

SJ Semiconductor’s listing highlights the growing role of chip packaging in China’s strategy to narrow the technology gap.

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...