Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

Karl Suss KB GmbH & Co. today introduced a fully automatic probe system for use in the electrical testing of ball grid array (BGA) structures. The Munich, Germany-based company said the tool will save ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...