The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...

High-performance bonding materials like OEM-specified polyurethane and acrylic tapes are the ideal method when it comes to automotive attachment applications. Selecting the right tape for your ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

To meet the requirements of your electrical safety testing applications, you can choose from a variety of instruments and systems that perform hipot, insulation-resistance (IR), ground-resistance, and ...

Part of the HYAMP III series of manual ground-bond testers from Associated Research, the Model 3145 provides up to 40 A of DC ground-bond test current for alternative-energy and solar test ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

Newson Gale's Bond-Rite EZ grounding and testing assembly is designed for applications where operators must establish a temporary low-resistance bond or connection to a local ground point. It should ...