The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

A common practice when designing embedded computing systems for aerospace and defence applications is to use down-board DRAMs which are extremely reliable, have very efficient thermal ratings and the ...