Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

The supply chain starts with raw materials and ends up with the finished products that get delivered to your store and in the hands of the consumer. Products make numerous stops along the supply chain ...

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

Frequently employed in the automotive industry, among others, the eight disciplines problem solving (8D) methodology is a quality practice aimed at product and process improvement that can help ...

In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

New York, Feb. 23, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Semiconductor Assembly And Packaging Equipment Global Market Report ...

Companies choose manufacturing processes -- such as job order, batch process, assembly line and continuous process -- based in part on the level of product individualization allowed. Manufacturers use ...