Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
The Siemens SINAMICS G220 multipurpose adjustable-speed drive uses built-in Clean Power technology to reduce harmonics by up to 97% without an AC line reactor or DC choke. It is the first drive to ...
Siemens introduces three compact communication modules and an industrial router for its popular Simatic S7-1200 controller. The compact CP 1243-1, CP 1243-1 DNP3, and CP 1243-1 IEC communications ...
A power module is a high-power switching circuit used in applications for electric vehicles, renewable energy, photovoltaics, wind power, and much more. Switching-element IGBTs and MOSFETs are used in ...
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