Testing Devices In Module Packages And Designing Cryogenic Current Sensors For All-Electric Aircraft
A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...
NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE:TER) introduces the ETS-88TH, the latest addition to the ETS-88 product line designed to test IGBT, MOSFET, and power module devices. The ...
System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Wilsonville, OR. Mentor Graphics today announced a new MicReD Power Tester 600A product, which tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD ...
A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.
Power Integrations announced a family of gate-driver boards for Infineon EconoDual power switching modules. The family is called Scale EV, and its first member is 2SP0215F2Q0C, designed for the ...
New IXIDM1401 driver module combines supreme compactness with the highest performance and reliability. IXYS’ objective is to serve the market with IGBT driver parts that enable a short design circle ...
NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE:TER) introduces the ETS-88TH, the latest addition to the ETS-88 product line designed to test IGBT, MOSFET, and power module devices. The ...
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