A technical paper titled “Test Generation for Subcircuits with High Functional Switching Activities” was published by Irith Pomeranz at Purdue University. Abstract “Chip aging results in defects that ...
A new technical paper titled “Ultrafast visual perception beyond human capabilities enabled by motion analysis using synaptic ...
A new technical paper titled “Advances in You Only Look Once (YOLO) algorithms for lane and object detection in autonomous ...
As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...
How much of the energy consumed in an AI chip is spent doing something useful? This question affects everything from software ...
This paper details how AnalogPort, a leading high-speed interconnect solutions provider, successfully addressed these limitations using Siemens EDA’s Symphony Pro (part of Solido Simulation Suite) for ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
AI chip for SDVs; hypercar; automotive edge chip; Waymo's new GenAI model; neuromorphic detects motion 4X faster; sodium-ion battery; Ferrari-all electric; carmakers' recalibrations on EVs; batteries ...
Version 3.0 of the interconnect standard doubles bandwidth and supports new use cases and enhanced manageability.
Specification quality is another key challenge. Formal verification depends on clear intent, yet specifications are often incomplete, ambiguous, or difficult to operationalize. AI can help extract ...
Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.
In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...
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