Semiconductor Engineering

Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Semiconductor Engineering

LLM- Based Techniques To Support Behavior-Driven Development For HW Design (U. of Bremen, DFKI)

A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...
Semiconductor Engineering

Research Bits: Dec. 22

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...