Abhijeet Chakraborty, VP Engineering at Synopsys, presented one of the keynotes at the 2025 Chiplet Summit (watch the video ...

Multi-die and chiplet-based designs — which integrate multiple specialized dies in a single package or stack integrated circuits vertically — stand to deliver far greater performance and flexibility ...

President Donald Trump said on Tuesday U.S. lawmakers should get rid of a landmark 2022 bipartisan law to give $52.7 billion in subsidies for semiconductor chips manufacturing and production and ...