Abstract: The article examines the analysis of the financial state of the enterprise as an information system for managing financial and economic activities. It has been proven that the financial ...

Tessellations aren’t just eye-catching patterns—they can be used to crack complex mathematical problems. By repeatedly ...

Discover how Fourier Analysis breaks down complex time series data into simpler components to identify trends and patterns, despite its limitations in stock forecasting.

Learn the difference between Excel COUNT and COUNTA, plus TEXTBEFORE and TEXTAFTER tricks, so you clean text and totals with ...

Duke University engineers are using artificial intelligence to do something scientists have chased for centuries; turn messy, real-world motion into simple rules you can write down. The work comes ...

Duane Keith "Keefe D" Davis’ trial for the murder of 2Pac has been pushed due to an overwhelming amount of evidence. Complex can confirm that Davis' trial has been pushed back to August 10, 2026, ...

The November blaze was the worst in Hong Kong in nearly 80 years. At least 161 people have died and the authorities have arrested more than two dozen people as they investigate the cause. By Alexandra ...

SAN ANTONIO – A three-alarm fire that broke out late Saturday night at a Northwest Side apartment complex reignited Sunday morning, according to the San Antonio Fire Department. Crews initially ...

A firefighter and several other people were injured after an apartment complex caught fire in Camden County, New Jersey. According to the Gloucester Township Police Department, the fire broke out at ...

Decades of research has viewed DNA as a sequence-based instruction manual; yet every cell in the body shares the same genes – so where is the language that writes the memory of cell identities?

Photo: The LECO Pegasus BTX system in Cal State LA’s LECO Complex Chemical Compositional Analysis Lab enhances research and student training in advanced chemical analysis. Cal State LA has completed a ...

The semiconductor industry is entering an era defined by heterogeneous integration and complex packaging technologies. Innovations such as wafer-on-wafer bonding, chiplets, multi-stacked die (2.5D/3D) ...