High‑NA EUV's reduced field size is driving new innovation in optical proximity correction and mask synthesis.

Apple iPhone Fold, iPhone 18, Google Pixel 11 and Other Phones We Expect in 2026 ...

The group's contract chipmaking business, Huali Microelectronics, is readying a 7-nanometre (nm) chipmaking process at its ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

Advanced Packaging (AP) has now become recognized even by the Fabless Chip Designers of the now Silicon LESS Silicon Valley ...

OpenLight to Showcase Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026 SANTA CLARA, CA, ...

No longer Apple's MacBook entry point, the 13-inch Air is now a bit of a question mark for students, while the rest of us are probably better off with the larger Air.

The 3.2T DR8 PIC with 448G EAMs delivers clear benefits in power efficiency, cost, and time to production.”— Dr. Adam ...

Abstract: Micro light-emitting diode (Micro-LED) has attracted significant research interest owing to its outstanding optoelectronic properties. Flip-chip thermo-compression bonding is a critical step ...

Abstract: This paper presents improved flip-chip bonding for silicon carbide (SiC) dummy chips with a silicon dioxide (SiO₂) insulation/passivation layer, targeting high-temperature (up to 600 °C) ...

United Microelectronics Corporation (UMC), the giant Taiwan-headquartered chip foundry, has signed a licensing deal to transfer and scale up production of devices using the “iSiPP300” silicon ...